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Patent Searching and Data


Title:
BUMP TREATING DEVICE ASSEMBLY AND BUMP TREATING METHOD
Document Type and Number:
Japanese Patent JP2013183803
Kind Code:
A
Abstract:

To effectively suppress rise of the internal pressure in a bump and to reduce an influence on the peripheral tissue.

A bump treating device assembly 10 includes: a clip 18 which has a prescribed elasticity and which can be inserted into a bump 102 formed in a blood vessel 100; and a shaft 12 which supports the clip 18 and which is relatively retractable to the clip 18. The clip 18 has a plurality of extensions 30 extending toward the proximal end and a distal end connecting part 28 for connecting and supporting the distal ends of the plurality of extensions 30. The plurality of extensions 30 in a natural state are formed in such a shape that proximal end opposing parts 36a of the plurality of extensions 30 are approximate to each other. The plurality of extensions 30 are elastically deformed and opened as the shaft 12 moves forward and abuts to the extensions. Then, the extensions 30 are restored to the natural state from the opened sate as the shaft 12 moves backward, and the extensions 30 are removed from the shaft 12 with the proximal end opposing parts 36a holding a wall 102a of the bump 102.


Inventors:
FUKUOKA TETSUYA
EBATA KATSUKI
Application Number:
JP2012049569A
Publication Date:
September 19, 2013
Filing Date:
March 06, 2012
Export Citation:
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Assignee:
TERUMO CORP
International Classes:
A61B17/12
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Shuji Ouchi
Yasuharu Nakasone
Shiro Sakai
Akira Yamano