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Title:
BUNDLED WIRE-LIKE MATTER AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2005001760
Kind Code:
A
Abstract:

To provide a bundled wire-like matter and a method of manufacturing the same capable of increasing the gathered quantity of wire-like members per unit by gathering only the wire-like members and capable of preventing troubles such as collapse of the gathered matter due to deformation, twisting and tangling by taking out the wire-like member with bundling means being attached thereto.

The method of manufacturing the bundled wire-like matter comprise a process that windable wire-like members 2 such as electric wires, cords, strings or various kinds of hoses are wound in an 8-shaped pattern by a plurality of times by a gathering fixture 5 provided with bars opposite to each other and are gathered in a state of being stacked in double, the obtained gathered matter is bundled with various bundling means 3 such as container comprising strings or a bag body or the like, and one end of the wire-like members is protruded outwardly to thereby form a drawing section 4.


Inventors:
KANIYOSHI TOMOKICHI
Application Number:
JP2003196783A
Publication Date:
January 06, 2005
Filing Date:
June 10, 2003
Export Citation:
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Assignee:
KANIYOSHI TOMOKICHI
International Classes:
B65B27/06; B65B67/00; B65D85/04; (IPC1-7): B65D85/04; B65B67/00