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Title:
BUNDLING APPARATUS AND BUNDLING METHOD
Document Type and Number:
Japanese Patent JP2008184163
Kind Code:
A
Abstract:

To provide a bundling apparatus capable of preventing inferiority of bundling from occurring by controlling adhesive temperature and discharging temperature of a paper belt and to provide a bundling method.

Heat bonding is started by pressing the paper belt K by an iron 40E2 heated by a heater 40E1, and counting of a heating time timer HTm is started. Then, by comparing the measured temperature Tmp of the paper belt K measured by a temperature measuring device 40C with a set temperature Ts during heating, heating is continued until the measured temperature Tmp reaches the set temperature Ts. When the measured temperature Tmp reaches the set temperature Ts, heating of the paper belt K by pressing by the iron is stopped. At the same time, the counting of the heating time timer HTm is stopped. Then, the strip is kept cooled until the measured temperature Tmp reaches below the set temperature Td at cooling. When the measured temperature Tmp is below the set temperature Td or lower, a belt pressing member 40D and a strip bending member 40G are retreated and the bundle H is discharged. Then, the set temperature Ts at heating is corrected by the counting value of the heating time timer HTM.


Inventors:
KUSANO NOBUYUKI
Application Number:
JP2007016767A
Publication Date:
August 14, 2008
Filing Date:
January 26, 2007
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B65B27/08; B65B13/18; B65B13/32; G07D9/00
Attorney, Agent or Firm:
Hiroshi Horiguchi



 
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