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Title:
BUNDLING APPARATUS FOR OBJECT TO BE BUNDLED
Document Type and Number:
Japanese Patent JP2005162312
Kind Code:
A
Abstract:

To provide a bundling apparatus for an object to be bundled with a comparatively simple structure, which can perform efficient bundling operation of up-and-down piled objects to be bundled.

The bundling apparatus is equipped with a movement receiver 20 to store the object to be bundled 54, a drive chain 6 to move the movement receiver 20, a tape sticking mechanism 72 arranged in a tape sticking area 60, a first tape pressing mechanism 202 arranged in a first tape pressing area 62 and a second tape pressing mechanism 22 arranged in a second tape pressing area 64. The tape sticking mechanism 72 sticks a bundling tape 66 from the upper faces of the two or more objects 54 to be bundled to both side faces and the first tape pressing mechanism 202 windingly sticks one end of the bundling tape 66 stuck on the objects to be bundled on the lower side of the lowest object to be bundled and the second tape pressing mechanism 222 windingly sticks the other end of the bundling tape 66 stuck on the objects 54 to be bundled on the lower side of the lowest object 54 to be bundled.


Inventors:
IGARASHI HIROTAKA
Application Number:
JP2003407863A
Publication Date:
June 23, 2005
Filing Date:
December 05, 2003
Export Citation:
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Assignee:
KYOTO SEISAKUSHO
International Classes:
B65B13/18; B65B27/00; (IPC1-7): B65B13/18; B65B27/00
Attorney, Agent or Firm:
Tadaaki Kishimoto