Title:
BUNDLING APPARATUS FOR SLIT COIL AND BUNDLING METHOD
Document Type and Number:
Japanese Patent JP2007106432
Kind Code:
A
Abstract:
To efficiently and rapidly bundle slit coils with a band.
In a bundling apparatus 100 for slit coils, a bundling band 13 is inserted into a central space 1s of coil pieces 1a-1f, and the inserted bundling band 13 is pulled out to a specified position along the radial direction from a gap between the coil pieces with a bundling band drawing/cutting device 17. The bundling band 13 pulled out to the specified position is cut there, and the ends of the bundling band are bound to horizontally bundle them with the band by using a magic hand 18.
Inventors:
Yoshinaga, Yoichi
Enoeda, Seiji
Nishina, Yoshiaki
Kitahama, Masanori
Itabashi, Kazuo
Enoeda, Seiji
Nishina, Yoshiaki
Kitahama, Masanori
Itabashi, Kazuo
Application Number:
JP2005000297556
Publication Date:
April 26, 2007
Filing Date:
October 12, 2005
Export Citation:
Assignee:
JFE STEEL KK
JFE KONAN STEEL CENTER:KK
JFE KONAN STEEL CENTER:KK
International Classes:
B65B27/06; B65B27/00
