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Title:
BUNDLING BAND AND BUNDLING DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2009096550
Kind Code:
A
Abstract:

To provide a bundling device, which can bundle objects to be bundled with a bundling band by only work that an operator holds the both ends of the objects laid down by both hands and passes the objects through the device one time.

A pair of bundling rollers 28a and 28b, which bend and pass the belt-shaped bundling band 11 having a securing hole and a securing projection on the both ends, are arranged in the bundling device 20. A horizontal semicircle cylindrical space 29a and 29b to bundle the objects to be bundled 17 are provided on the perimeters of both bundling rollers. The objects to be bundled are pushed down onto the bundling band placed between the highest parts of the perimeters of both bundling rollers and then both rollers rotate synchronously to bend the bundling band in a nearly U-shape and wind the bundling band around the objects to be bundled. They are pushed down further and the bundling rollers make both ends of the bundling band engage to bundle the objects to be bundled with the bundling band.


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JP2008074462BINDING TOOL
Inventors:
KANEKO SATOSHI
MAKIYAMA TAKESHI
Application Number:
JP2008064918A
Publication Date:
May 07, 2009
Filing Date:
February 15, 2008
Export Citation:
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Assignee:
KANEKO DENKI KK
International Classes:
B65D63/10; B65B27/00
Domestic Patent References:
JPS5280780U1977-06-16
JPS63120875U1988-08-04
JPS6099866A1985-06-03