Title:
結束装置及びその方法
Document Type and Number:
Japanese Patent JP6655309
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a binding device and a method of the same, capable of binding an object to be bound having an arbitrary outer diameter without enlarging the entire device.SOLUTION: A binding device 10 for binding an object P to be bound by a binding tape T comprises: a second pressing part 14b for fixing a tip part Ta of the binding tape T in a state of extending the binding tape T in a first direction A; a first movable base 2 for pressing the binding tape T, whose tip part Ta is fixed to the object P to be bound by the second pressing part 14b, from a second direction B crossing the first direction A, and winding the binding tape T along an outer periphery of the object P to be bound; a third pressing part 14d for pressing and bonding extension parts Te extending from both end parts Td of the binding tape T that is wound around the object P to be bound by the first movable base 2; and a cutting part 15a for cutting the binding tape T so as to leave at least a part of a bonded part Tf where the extension parts Te of the binding tape T are bonded to each other by the third pressing part 14d.SELECTED DRAWING: Figure 7
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Inventors:
Takeshi Saito
Takao Nishimura
Shimobayashi Tomoo
Takao Nishimura
Shimobayashi Tomoo
Application Number:
JP2015130957A
Publication Date:
February 26, 2020
Filing Date:
June 30, 2015
Export Citation:
Assignee:
Sun NTT Co., Ltd.
International Classes:
B65B13/08
Domestic Patent References:
| JP58020610A | ||||
| JP2011088670A | ||||
| JP53127091A |
Attorney, Agent or Firm:
Hiroshi Masaki
Yuko Mikami
Tadashi Fujikawa
Yuko Mikami
Tadashi Fujikawa