Title:
BUNDLING DEVICE
Document Type and Number:
Japanese Patent JPS58203809
Kind Code:
A
Abstract:
IIn a bundling apparatus, a main clamping mechanism (42) presses a stack of paper sheets (P) in the direction of thickness of the stack and holds the stack. A band (MT) is wound by a winder (41) around the stack of paper sheets (P) held by the main clamping mechanism (42). The end portions of the band (MT) wound around the stack of paper sheets (P) are bonded by a heat-bonding mechanism (43). Specified data is stamped on the band (MT) wound around the stack by a data-stamping mechanism (112) which includes a stamp (113) bearing the specified data and a drive mechanism (114) for bringing the stamp (113) into contact with the band (MT) while the end portions of the band (MT) are being bonded to each other.
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Inventors:
MIYANO TOSHIYUKI
OOMURA HIDEO
OOMURA HIDEO
Application Number:
JP8096882A
Publication Date:
November 28, 1983
Filing Date:
May 13, 1982
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
B65B27/08; (IPC1-7): B65B13/18; B65B27/08
Domestic Patent References:
| JPS578616A | 1982-01-16 |
Attorney, Agent or Firm:
Masayoshi Misawa
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