Title:
BURN-IN BOARD
Document Type and Number:
Japanese Patent JP2015017805
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a burn-in board easy to manufacture while dispensing with a socket and capable of achieving manufacturing cost reduction.SOLUTION: A burn-in board loading thereon a surface mount semiconductor device includes: a plurality of array through-holes arranged in the same array as that of an external electrode of the semiconductor device; a coiled contact including a spring part having a wire wound in a coil state, continuous to one of the array through-holes while being inserted into the array through-hole, and contractible in a longitudinal direction; and a holder holding the coiled contact in a state of inserting the coiled contact into one of the through-holes. The coiled contact is formed out of the wire extending from one end of the sprint part, and includes: a tip end portion in contact with the external electrode; and a flange portion connected to the other end of the spring part. The holder includes a first pressing member pressing the flange portion against an end portion of one of the array through-holes in the state of inserting the coiled contact into the array through-hole.
Inventors:
SHIBATA KAZUAKI
MITAKE KENICHI
HAMAMATSU YUICHIRO
SHIBATA AKIRA
MITAKE KENICHI
HAMAMATSU YUICHIRO
SHIBATA AKIRA
Application Number:
JP2013142968A
Publication Date:
January 29, 2015
Filing Date:
July 08, 2013
Export Citation:
Assignee:
HI SYSTEC INC
International Classes:
G01R31/26; G01R1/073
Attorney, Agent or Firm:
Yoshinaga Junichi