Title:
BURN-IN BOARD
Document Type and Number:
Japanese Patent JPH0643208
Kind Code:
A
Abstract:
PURPOSE: To provide a burn-in board used for the burn-in test of semiconductor devices and facilitating the fitting and removal of tested ICs to sockets.
CONSTITUTION: In a burn-in board provided with many IC sockets on a burn-in board main body 20 made of a printed board, the IC socket is constituted of a socket main body 22 fixed to the burn-in board main body 20 and a block 25 pressed with an IC 21 coupled with the socket main body 22. The socket main body 22 has a contact 24 brought into elastic contact with the terminal 23 of the IC 21 and a prostratable hook 26 fixing the block 25, and the block 25 has the length capable of pressing multiple ICs 21 coupled with multiple socket main bodies 22 arranged in a line at a stretch.
Inventors:
KATAOKA HIROBUMI
Application Number:
JP19561292A
Publication Date:
February 18, 1994
Filing Date:
July 22, 1992
Export Citation:
Assignee:
FUJITSU MIYAGI ELECTRON KK
International Classes:
H01L21/326; H01L21/66; H01L23/32; G01R31/26; (IPC1-7): G01R31/26; H01L21/326; H01L21/66; H01L23/32
Attorney, Agent or Firm:
Aoki Akira (3 outside)
Next Patent: SEMICONDUCTOR INSPECTING DEVICE