PURPOSE: To make it easy to remove burrs on a molded product by a method wherein thrust-down sections corresponding to the positions of the burrs on the product are provided and the product and thrust-down sections are oscillated relatively to each other.

CONSTITUTION: Thrust-down sections 21 are provided opposite to burrs 8 respectively generating on a semiconductor IC1 mold. When the IC1 is carried to a burrs removing position, an elevating member 17 lowers to bring the thrust-down sections 21 into contact with the burrs 8 respectively. Then the thrust-down sections 21 are ocillated together with an oscillating member 18 driven by an ultra sonic oscillator 20 and the sections 21 are lowered further to thrust down the burrs. Thus, the burrs on the molded product are removed easily and without fail.