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Patent Searching and Data


Title:
BURRING DIE DEVICE
Document Type and Number:
Japanese Patent JP2013099767
Kind Code:
A
Abstract:

To provide a burring die device with which a plurality of burring holes are worked in positions in proximity.

In the burring die device on which an upper die 3 and a lower die 2 are arranged on the vertical same axial center so as to perform approaching/receding movement relatively and a prepared hole portion of a metal plate (a) which is situated between the upper die 3 and the lower die 2 are worked into burring holes by the approaching movement of the upper die 3 and the lower die 2, a cylindrical part 12 which is made like the same axial center with the die chip 4 and projected upward is provided on the opposite surface to the upper die 3 in the die 5 of the lower die 2, a cylindrical and small diameter cylinder 21 for controlling the outside diameter of a cylindrical wall (c) is projectingly provided on the opposite surface of the upper die 3 to the lower die 2 and the projecting height of the cylindrical part 12 and the small diameter cylinder 21 are set so as to be higher than the projection amount of the cylinder wall (c) of the burring hole (b) to be worked.


Inventors:
NISHIMURA HIKOZO
Application Number:
JP2011245567A
Publication Date:
May 23, 2013
Filing Date:
November 09, 2011
Export Citation:
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Assignee:
NISHIMURA SEISAKUSHO CO
International Classes:
B21D19/08; B21D28/36
Attorney, Agent or Firm:
Bunji Kamada
Higashio Masahiro
Takayoshi Tagawa