Title:
BUS BAR MODULE
Document Type and Number:
Japanese Patent JP2015033201
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a structure, which makes heat of a power card less likely to be transmitted to current sensors, in a bus bar module connected with a terminal of the power card and in which the current sensors are integrated with multiple bus bars with a resin.SOLUTION: In a bus bar module 10 disclosed by the specification, multiple bus bars 12 are integrated by a first resin part 13 and a second resin part 14. In the first resin part 13, multiple current sensors 17 which measure currents flowing through the respective bus bars 12 and parts of the multiple bus bars are molded by a resin. In the second resin part 14, the other parts of the multiple bus bars 12 are molded by a resin at the side located closer to the power card 21 than the first resin part 13. Heat conductivity of the second resin part 14 is higher than heat conductivity of the first resin part 13. The second resin part 14 is fixed to a housing 30 of an inverter 5.
Inventors:
YAMANAKA MASASHI
Application Number:
JP2013160631A
Publication Date:
February 16, 2015
Filing Date:
August 01, 2013
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
H02M7/48
Attorney, Agent or Firm:
Patent business corporation KAI-U Patent Law Firm
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