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Patent Searching and Data


Title:
バスバー構造物
Document Type and Number:
Japanese Patent JP6534774
Kind Code:
B2
Abstract:
Provided is a bus bar structure which may be suitable for reducing an occupied area of a printed circuit board (PCB) by removing a fuse from the PCB in an interconnect board (ICB) assembly of a battery pack. According to the present disclosure, the bus bar structure may include: bus bars which face each other and are arranged below the PCB in the ICB assembly of the battery pack; and a fuse case between the bus bars, wherein the fuse case includes a fuse wire therein and is configured to bring the fuse wire into contact with the bus bars via at least one end thereof.

Inventors:
Yang-Kyu Choi
Bo-Sung Kim
Sun-Yoon Chung
Song-Tae Kim
Jun-Yop Sung
Application Number:
JP2018513255A
Publication Date:
June 26, 2019
Filing Date:
July 11, 2016
Export Citation:
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Assignee:
LG HAUSYS,LTD.
International Classes:
H01M50/204; H01M50/50; H01M50/503; H01M50/507; H01M50/519; H01M50/522
Domestic Patent References:
JP2015507819A
JP2001338633A
JP62142144U
JP2014519153A
Foreign References:
US20140315051
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe