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Title:
流体ポンプ用のバイパス通路
Document Type and Number:
Japanese Patent JP5520481
Kind Code:
B2
Abstract:
A fluid pump (10) includes a pumping chamber (14), an inlet (16) and an outlet (18) fluidly connected with the pumping chamber, and a passage (24) fluidly connected between the inlet and the outlet. Fluid flowing through the passage bypasses the pumping chamber. In one example, the fluid pump (10) pumps coolant within a vehicle cooling system between a heater core (23b) and a vehicle engine (23a).

Inventors:
Lincoln, Thomas
Cleft, Dennis
Wade, Timothy
Application Number:
JP2008526133A
Publication Date:
June 11, 2014
Filing Date:
August 08, 2006
Export Citation:
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Assignee:
Cooper-Standard Automotive, Incorporated
International Classes:
F04D29/42
Domestic Patent References:
JP4209992A
JP9112380A
JP2055824A
JP112344A
Foreign References:
FR788955A1
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Yuko Hara



 
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