Title:
BYTE CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2019055451
Kind Code:
A
Abstract:
To provide a byte cutting device which can cut a large plate-like work-piece in a short time by two bytes.SOLUTION: A byte cutting device 1 comprises a table 30, cutting means for cutting a plate-like work-piece top face, cutting feed means 12 for moving the table 30, height control means 21, 22 which move the cutting means in a vertical direction. The cutting means comprises juxtaposed first cutting means 6A and second cutting means 6B, and the first cutting means 6A and the second cutting means 6B comprise a long flange 61(65) which is connected to a tip of a rotary shaft 600(640) and holds the byte, and a spindle unit 60(64) which rotatably supports the rotary shaft 600(640). According to this byte cutting device, a rotation direction of the rotary shaft 600 of the first cutting means 6A and a rotation direction of the rotary shaft 640 of the second cutting means 6B are so made as to be opposite to each other, and a first cutting mark which is cut by the byte of the first cutting means 6A and a second cutting mark which is cut by the byte of the second cutting means 6B are overlapped on each other, whereby the plate-like work-piece is cut.SELECTED DRAWING: Figure 1
Inventors:
NAMIOKA SHINICHI
Application Number:
JP2017181136A
Publication Date:
April 11, 2019
Filing Date:
September 21, 2017
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23B5/00; B23B25/06; B23Q17/20
Domestic Patent References:
| JP2016040063A | 2016-03-24 | |||
| JP2013230546A | 2013-11-14 | |||
| JP2012240131A | 2012-12-10 | |||
| JPS5278191A | 1977-07-01 | |||
| JP2011044569A | 2011-03-03 | |||
| JPH0375944U | 1991-07-30 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office