Title:
ＣＭＰ装置及び方法
Document Type and Number:
Japanese Patent JP7271619
Kind Code:
B2
Abstract:
To provide a wafer adsorption device and a CMP device capable of strongly adsorbing and holding the entire surface of a wafer.SOLUTION: An air bag 62d expands and pushes the vicinity of the center of an adsorption member 64 downward, and therefore, a suction member 64 is elastically deformed into a convex crown shape downward. An in-table 71 brings a wafer W close to the elastically-deformed adsorption member 64 to bring the wafer W into close contact with the adsorption member 64 sequentially from the vicinity of the center toward the outer periphery.SELECTED DRAWING: Figure 12
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Inventors:
Daichi Nagai
Application Number:
JP2021131486A
Publication Date:
May 11, 2023
Filing Date:
August 11, 2021
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B37/005; B24B41/06; H01L21/304; H01L21/677
Domestic Patent References:
| JP2003053661A | ||||
| JP2003289058A | ||||
| JP9141550A | ||||
| JP2006239786A | ||||
| JP2004237373A | ||||
| JP2004031960A | ||||
| JP2012223856A | ||||
| JP2000127034A | ||||
| JP2012076169A | ||||
| JP2010253579A |
Attorney, Agent or Firm:
Takamitsu Shimizu