Title:
CMP DEVICE
Document Type and Number:
Japanese Patent JP2022161983
Kind Code:
A
Abstract:
To provide a CMP device capable of suppressing a change in a polished shape of a wafer due to a change in template thickness with time.SOLUTION: A CMP device 1 includes a retainer ring holder 41 provided with an accommodation pocket 41a capable of accommodating a wafer W at the center, a membrane film 50 attached to the upper surface of the retainer ring holder 41, and a backing film 60 which is smaller in diameter than the wafer W and attached to the membrane film 50 in the accommodation pocket 41a. Even when the retainer ring holder 41 wears and the pocket height H decreases, the wafer W is pressed without being elastically deformed such that the backing film 60 wraps around the outside of the periphery of the wafer W, and the polishing rate at the periphery of the wafer W is prevented from significantly fluctuating as compared to the polishing rate in other regions of the wafer W.SELECTED DRAWING: Figure 5
Inventors:
Daichi Nagai
Application Number:
JP2022129160A
Publication Date:
October 21, 2022
Filing Date:
August 15, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B37/30; H01L21/304
Attorney, Agent or Firm:
Takamitsu Shimizu