Title:
CMP pad state regulation tool
Document Type and Number:
Japanese Patent JP6022477
Kind Code:
B2
Abstract:
The present disclosure provides a CMP pad conditioning tool with at least one integral abrasive protrusion. The present disclosure further provides a method for preparing this CMP pad conditioning tool, along with a method for using said tool to condition a CMP pad.
Inventors:
Gary E. Leland
Charles Rally
Thomas Charles Easley
James Graham
Mark Schweiser
Charles Rally
Thomas Charles Easley
James Graham
Mark Schweiser
Application Number:
JP2013546301A
Publication Date:
November 09, 2016
Filing Date:
December 20, 2011
Export Citation:
Assignee:
Diamond Innovations, Inc.
International Classes:
H01L21/304; B24B37/00; B24B53/12
Domestic Patent References:
| JP2010125567A | ||||
| JP2009095898A | ||||
| JP2000296457A | ||||
| JP2008540154A | ||||
| JP3500765A |
Foreign References:
| US20060258276 | ||||
| US6027659 | ||||
| US20070197142 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Yoshihiro Kobayashi
Yasuo Dogaki
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Yoshihiro Kobayashi
Yasuo Dogaki
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