Title:
CMUTデバイス及び製造方法
Document Type and Number:
Japanese Patent JP6422991
Kind Code:
B2
Abstract:
Disclosed is a method of manufacturing a device (1) comprising a plurality of micro-machined ultrasonic transducer cells (100) in a first region (10) on a substrate (30) and a plurality of interconnects (200) in a second region (20) on said substrate, each of said cells comprising a first electrode (110) separated by a cavity (130) from a second electrode (120) supported by a membrane (140), the method comprising forming a dielectric layer stack (11, 13, 15, 17) over the substrate, said dielectric layer stack defining the respective membranes of the micro-machined ultrasonic transducers in the first region; reducing the thickness of the dielectric layer stack in the second region by partially etching away the dielectric layer stack in the second region; etching a plurality of trenches (22) in the reduced thickness portion of the dielectric layer stack, each of said trenches exposing a conductive contact (210) in the second region; and filling said trenches with a conductive material. A device manufactured in accordance with this method and an apparatus including the device are also disclosed.
Inventors:
Maukzok Rüdiger
Marquelis bout
Marquelis bout
Application Number:
JP2016557627A
Publication Date:
November 14, 2018
Filing Date:
March 09, 2015
Export Citation:
Assignee:
KONINKLIJKE PHILIPS N.V.
International Classes:
H04R31/00; B81B3/00; B81C1/00; H04R19/00
Domestic Patent References:
| JP2013219303A | ||||
| JP2009050560A | ||||
| JP2007528153A |
Foreign References:
| WO2005114820A2 |
Attorney, Agent or Firm:
Patent Services Corporation m&s Partners
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