To conduct complete removal and confirmation of an outside semiconductive layer at the same time, by detecting electrical resistance between a cutter blade for chipping a semiconductive layer and an electrode coming into contact with a cable insulator.

An outside semiconductive layer 2 is removed by advancing a cutting edge 3 in an arrowhead direction. When the outside semiconductive layer 2 is removed completely, an electrode 4 traces the surface of the insulator 1 of a cable. As a result, A resistance value between the cutter blade 3 and the electrode 4 increase remarkably more than in a case where cutting of the outside semiconductive layer 2 is left incomplete. Increase or decrease in the resistance value is detected by a detector 5. The increase in the resistance value over the whole periphery of the cable is confirmed, and the removal of the outside semiconductive layer 2 is completed. It is thus possible to conduct removal of the outside semiconductive layer 2 and confirmation of complete removal at the same time.