Title:
センサモジュール付きケーブル
Document Type and Number:
Japanese Patent JP6955683
Kind Code:
B2
Abstract:
To provide a cable with a sensor module which is capable of suppressing influence of heat or a failure such as disconnection in the case of forming resin by molding, and excellent in vibration resistance and heat resistance.SOLUTION: A sensor module 3 provided at an end part of a cable 43 having a plurality of electric wires 42 comprises: a magnetic field sensor 4 having a sensor body part 40 including a magnetic field detection element 40a and a plurality of lead wires 41 drawn from the sensor body part 40, and electrically connected to the electric wires 42; a housing case 31 having a connection part housing part 31A housing a connection part 44 electrically connecting the electric wires 42 to the lead wires 41; and a molded body 32 made of mold resin formed to cover at least a part of the housing case 31 without contacting the sensor body part 40. The connection part housing part 31A comprises: an electric wire holding wall 31B holding the electric wires 42; and a sensor holding wall 31C holding the magnetic field sensor 4 by holding the lead wires 41.SELECTED DRAWING: Figure 4
Inventors:
Yukio Ikeda
Application Number:
JP2021016550A
Publication Date:
October 27, 2021
Filing Date:
February 04, 2021
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
G01P1/02; G01D5/245; G01P3/487
Domestic Patent References:
| JP2013148556A | ||||
| JP2014134492A | ||||
| JP2008216043A | ||||
| JP2005172811A | ||||
| JP944784A |
Foreign References:
| US20110179889 |