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Patent Searching and Data


Title:
CAMBER CONTROL METHOD IN SLICING DEVICE AND ITS DEVICE
Document Type and Number:
Japanese Patent JPH05104437
Kind Code:
A
Abstract:

PURPOSE: To control the camber of a wafer by detecting the existance of the camber at the time of cutting the wafer, and automatically execute the dressing of an inner peripheral blade.

CONSTITUTION: A camber control device is provided with a blade displacement detecting means 12, electrodes 13a, 13b severally arranged on the surface and the back side of an inner peripheral blade, a power source device 14 to apply D.C. voltage for electrolytic dressing between both the electrodes and the blade, and a changing over means 15 to change over a current fed from the power source device to either of the electrodes on the surface and the back side of the blade. A dull blade face is judged on the direction of blade displacement, and the changing over means 15 is changed over to the electrode on the side of the dull blade face and the power source device 14 is turned on and off on the quantity of blade displacement by a control device 16.


Inventors:
OUCHI HISAO
HAMAZAKI TATSUMI
KAWAGUCHI KEIJI
Application Number:
JP26927691A
Publication Date:
April 27, 1993
Filing Date:
October 17, 1991
Export Citation:
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Assignee:
TOYO A TEC KK
International Classes:
B23H5/00; B23D59/00; B23H5/10; B24B27/06; B24B49/18; B24B53/00; B28D5/02; (IPC1-7): B23H5/00; B23H5/10; B24B27/06; B24B49/18; B24B53/00; B28D1/22
Attorney, Agent or Firm:
Aoyama Ryo (2 outside people)