Title:
カメラモジュールの製造方法
Document Type and Number:
Japanese Patent JP7188316
Kind Code:
B2
Abstract:
To provide a manufacturing method of a camera module which can suppress the reduction in the product accuracy of a camera module due to the contraction of an adhesive for adhering a lens component to an imaging element substrate.SOLUTION: In the eighth step in a manufacturing process of a camera module, an imaging component is moved with the actuation of a six-axial drive stage such that the optical axis direction relative position of an imaging element substrate 16 with respect to a lens component 12 in an optical axis direction Db becomes a pre-cure target position. In a subsequent step, an adhesive 13 is cured. In the eighth step, the optical axis direction relative position where a gap amount Cz of an axial direction gap 12a becomes a pre-cure target gap amount C2z is used as the pre-cure target position. The pre-cure target gap amount C2z is obtained by adding a correction amount AMz determined on the basis of the contraction ratio of the adhesive 13 and a component measurement result to a post-cure target gap amount C1z. Consequently, the adhesive 13 is cured in such a positioning state where the contraction of the adhesive 13 following the curing is taken into account.SELECTED DRAWING: Figure 10
Inventors:
Nakagawa Hiroshi
Application Number:
JP2019143845A
Publication Date:
December 13, 2022
Filing Date:
August 05, 2019
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G02B7/02; G03B17/02
Domestic Patent References:
| JP2008153720A | ||||
| JP2006085004A | ||||
| JP2010114731A | ||||
| JP2016092761A | ||||
| JP2003172856A |
Foreign References:
| US20190052779 | ||||
| CN109391754A | ||||
| CN109773474A |
Attorney, Agent or Firm:
Patent Attorney Corporation Yuai Patent Office