To provide camera parts and a camera which are compact, have high sensitivity and are low cost, and to provide the manufacturing method of them.
At least all elements of a solid-state imaging element 1 on the upstream side of the optical path of incident light from photodiodes 101 are constituted of inorganic materials. That is, all the elements of the solid-state imaging element 1, including a color filter film 110 and lens films 109, 111 as well as insulation films 103, 105, 108 and a passivation film 107, are constituted of the inorganic materials. The solid-state imaging element 1 is mounted on a wiring board by using the solder reflow method, in a state where the solid-state imaging element 1 is contained in a package configured as a solid-state imaging apparatus.
INABA YUICHI
MATSUDA KENICHI
Shuji Matsumura
Kobayashi Kunito
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