Title:
容量デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込んだプリント配線板、ならびにそれらの製造方法
Document Type and Number:
Japanese Patent JP4970789
Kind Code:
B2
Abstract:
The present invention relates to a dielectric composition comprising: paraelectric filler; and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150.
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Inventors:
Gee Sidney Cox
Application Number:
JP2005368190A
Publication Date:
July 11, 2012
Filing Date:
December 21, 2005
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
H01G4/06; B32B7/025; H01L23/12; H05K3/46
Domestic Patent References:
| JP2004172530A | ||||
| JP5020924A | ||||
| JP11106516A | ||||
| JP57011407A | ||||
| JP2000505245A | ||||
| JP2004026640A |
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe