PURPOSE: To provide a capacitive sensor which is improved in the leading out reliability of electrodes provided on a substrate and mass productivity.

CONSTITUTION: A rectangular frame 2 in which a pressure-sensitive diaphragm section 4 is supported by a thin film-like elastically deformed section 3 is formed from a silicon wafer and a mobile electrode 5 is formed in the section 4. On the internal surface of the frame 2, the contact area of a connecting line 9 for connecting a fixed electrode 6 to an electrode pad is formed in an inverted-T shape. In addition, a cover 7 with the fixed electrode 6 is manufactured from another silicon wafer and the contact area of a leader line 8 for leading out the electrode is linearly formed on the internal surface of the cover 7. A pressure sensor 1 is manufactured by forming a metallic film having a rugged section with vertical stripes which are parallel with the wiring direction in the contact area of the lines 8 and 9 and joining the cover 7 with the frame 2 so that the lines can intersect each other in a contacting state.