To provide a capacitor arrangement support method capable of more easily setting appropriate arrangement of a capacitor on a multilayer board.

The maximum distance L_max between a power supply via 121 and a power supply via 141 is computed from width X and length Y of ground wiring 112, width x and length y of power supply wiring 111, width W of power supply wiring, a thickness h of a first dielectric layer, a thickness H of a second dielectric layer, the number n of ground vias 143, 144 connected to a capacitor 220, the number N of power supply vias 141, 142 connected to the capacitor 220, the number m of the ground vias 122 connected to an IC 210, the number M of power supply vias 121 connected to the IC 210, diameters R of the power supply vias 121, 141, 142 and the ground vias 122, 143, 144, impedance Z_c of the capacitor 220, a target frequency f_T, and target impedance ZT.