To provide a manufacturing method of a capacitor device which can form a capacitor on a substrate without causing any nonconformity even in the case of forming a dielectric layer by using a roller coater and the like.
The manufacturing method of a capacitor device comprises a process for forming an insulating layer 16 on a substrate 10, a process for forming recesses 16x and 16y in the insulating layer 16 by the imprint method, a process for obtaining a lower electrode 20 by embedding a metal layer in the recesses 16x and 16y of the insulating layer 16, a process for forming a photosensitive dielectric layer on the lower electrode 20, a process for forming an upper electrode 24 on a dielectric layer, and a process for forming a dielectric layer pattern 22 under the upper electrode 24 by using the upper electrode 24 as a mask so as to expose/develop a dielectric layer.
JP2016225611 | CHIP INDUCTOR |
JPS58157109 | PRINTED INDUCTANCE |
JPH09116247A | 1997-05-02 | |||
JP2002171048A | 2002-06-14 | |||
JP2003243795A | 2003-08-29 | |||
JPH07335830A | 1995-12-22 | |||
JP2004103617A | 2004-04-02 |