Title:
コンデンサおよびその製造方法
Document Type and Number:
Japanese Patent JP7354732
Kind Code:
B2
Abstract:
To improve the heat resistance of a capacitor such that the capacitor can be soldered with lead-free solder.SOLUTION: A capacitor 2 includes a capacitor body 4, a pedestal 6, and a resin layer 8. The capacitor body includes a sealing member 14. The pedestal is installed on the sealing member side of the capacitor body. The resin layer is arranged between the pedestal and the sealing member. Further, the sealing member has a surface to be treated 18 formed by removing the surface layer on the resin layer side, and the surface to be treated is bonded to the resin layer.SELECTED DRAWING: Figure 1
Inventors:
Ryuta Inoue
Koichi Nakata
Yohei Hashimoto
Keisuke Matsudaira
Koichi Nakata
Yohei Hashimoto
Keisuke Matsudaira
Application Number:
JP2019177868A
Publication Date:
October 03, 2023
Filing Date:
September 27, 2019
Export Citation:
Assignee:
Nippon Chemi-Con Corporation
International Classes:
H01G9/10; H01G2/10; H01G9/00
Domestic Patent References:
| JP6302480A | ||||
| JP6338439A | ||||
| JP2019186271A | ||||
| JP2018137264A | ||||
| JP629165A |
Attorney, Agent or Firm:
Masakazu Unemoto
Tsugitate Uemoto
Takuya Uemoto
Masaki Okita
Tsugitate Uemoto
Takuya Uemoto
Masaki Okita