To obtain the subject polymer easily producible at a low cost and having excellent heat-resistance by using a structure having carboranyl group, phenylene group and silylene group as a constituent unit and setting a weight- average molecular weight to be higher than a specific level.
This polymer has a weight-average molecular weight of ≥500 and has a structure having at least one carboranyl group, at least one phenylene group or its substituted group and at least one silylene group or its substituted group, preferably a structure of formula I or formula II (Y is carboranyl; R1 is H, a 1-20C alkyl, etc.; R2 is H, a 1-20C alkyl, etc.; (m) is an integer of 0-20) as a constituent unit. The polymer can be produced by reacting an ethynylene- containing silicon polymer with a borane compound. The objective polymer produced by this process has excellent high-temperature stability and heat- resistance and is crosslinkable and curable with heat, light, etc.
SUGIMOTO TOSHIYA
ICHITANI MOTOKUNI
Next Patent: WATER-REPELLENT MOLDED RESIN ARTICLE AND ITS PRODUCTION