Title:
光学部品の担持および光信号の接続のための担体構成およびその製造方法
Document Type and Number:
Japanese Patent JP2005507515
Kind Code:
A
Abstract:
The present invention relates to a carrier arrangement (10), in particular for carrying optical components and connecting optical signals, said carrier arranagement comprising a substrate (11) having at least one hole (12), said hole being provided with an optically conducting filing (13) for connecting said optical signals. The optically filling (13) comprises at least two different light conductive layers (131, 132) in the longitudinal direction of said hole.
Inventors:
Bergstead, Reff
Lovving, Byun
Lovving, Byun
Application Number:
JP2003541326A
Publication Date:
March 17, 2005
Filing Date:
November 04, 2002
Export Citation:
Assignee:
Imigo Arbe
International Classes:
G02B6/10; G02B6/122; G02B6/42; G02B6/43; H05K1/02; G02B6/36; (IPC1-7): G02B6/42; G02B6/122; H05K1/02
Attorney, Agent or Firm:
Masaaki Ogura