Title:
CARRIER DEVICE
Document Type and Number:
Japanese Patent JPH05254688
Kind Code:
A
Abstract:
PURPOSE: To restrain a substrate from being warped as far as possible at the time of carrying the substrate in a reflow soldering process or the like, and carry out stable carrying even at a high speed.
CONSTITUTION: Both the top and bottom surfaces of a substrate 1 are supported, being interposed between delivery pins 3a, 3b, 4a, 4b which serve as holding means provided at delivery chains 2a, 2b, to be delivered.
Inventors:
Hideki Ishii
Application Number:
JP6025392A
Publication Date:
October 05, 1993
Filing Date:
March 17, 1992
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K1/008; B65H5/08; H05K3/34; (IPC1-7): B65H5/08; B23K1/008; H05K3/34
Attorney, Agent or Firm:
Takada Mamoru
Previous Patent: JPS5254687
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