Title:
CARRIER FRAME AND RESIN SEALING METHOD
Document Type and Number:
Japanese Patent JP3499266
Kind Code:
B2
Abstract:
PURPOSE: To provide a carrier frame which is used for preventing resin from adhering to a board and a resin sealing method wherein the carrier frame is used.
CONSTITUTION: A carrier frame 12a is capable of holding a semiconductor device 10a composed of a semiconductor element 20a provided onto a board 18a and being fitted into molding dies 14 and 16 for sealing up the semiconductor element 20a of the semiconductor device 10a with resin. When the carrier frame 12a is fitted into the molding dies 14 and 16 holding the semiconductor device 10a, it is interposed between a resin passage 34 provided to the molding dies 14 and 16 and the board 18a of the semiconductor device 10a to prevent resin from coming into contact with the board 18a.
Inventors:
Masahiro Morimura
Application Number:
JP28092793A
Publication Date:
February 23, 2004
Filing Date:
November 10, 1993
Export Citation:
Assignee:
Apic Yamada Co., Ltd.
International Classes:
B29C45/26; B29C45/02; H01L21/56; H01L23/50; (IPC1-7): H01L21/56; B29C45/02; B29C45/26; H01L23/50
Domestic Patent References:
| JP2129933A | ||||
| JP57128930A |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
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