Title:
化学機械研磨のためのエッジ制御付きキャリアヘッド
Document Type and Number:
Japanese Patent JP4771592
Kind Code:
B2
Abstract:
A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.
Inventors:
Zuniga, Stephen
Chen, Han
Prab, Gopara Krishna, Bee.
Chen, Han
Prab, Gopara Krishna, Bee.
Application Number:
JP2000583673A
Publication Date:
September 14, 2011
Filing Date:
November 22, 1999
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/304; B24B37/30; B24B37/32
Domestic Patent References:
| JPH04343658A | 1992-11-30 | |||
| JPH11114806A | 1999-04-27 | |||
| JPH11226865A | 1999-08-24 |
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Yoshiki Hasegawa
Hideki Okita
Yuichi Yamada
Yasuhito Suzuki
Kobayashi Yoshinori
Yoshiki Hasegawa
Hideki Okita
Yuichi Yamada
Yasuhito Suzuki