Title:
CARRIER, METHOD AND APPARATUS FOR TESTING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3949256
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a positional shift between a semiconductor element and a membrane type contactor when a carrier for testing the semiconductor element is assembled and when the test is conducted in relation to the carrier, a method and an apparatus constituted for testing the semiconductor element with the use of the membrane type contactor.
SOLUTION: In a carrier for testing a semiconductor element which has a contact to electrically connect an electrode part of the semiconductor element 22, the carrier has a membrane-type contactor 24A, a pressuring mechanism 28A for pressuring the membrane type contactor 24A to the semiconductor element 22 from a face opposite to a face where the semiconductor element 22 is loaded, and a pressure hold body 26A for holding a face opposite to the face of the semiconductor element 22 in touch with the membrane type contactor 24A. Moreover, a butting part 30A is provided which is formed to project to the pressure hold body 26A thereby butting the membrane type contactor 24A with the pressure hold body 26A while holding the semiconductor element 22.
Inventors:
Makoto Haseyama
Application Number:
JP3771898A
Publication Date:
July 25, 2007
Filing Date:
February 19, 1998
Export Citation:
Assignee:
富士通株式会社
International Classes:
G01R31/26; G01R1/04; H01L21/66; (IPC1-7): G01R31/26; H01L21/66
Domestic Patent References:
| JP6176836A | ||||
| JP7050325A | ||||
| JP63105872U | ||||
| JP7201429A | ||||
| JP5333096A | ||||
| JP7159484A |
Attorney, Agent or Firm:
Tadahiko Ito
Previous Patent: VEHICULAR HEADLIGHT
Next Patent: COMPONENT RECOGNITION METHOD, COMPONENT INSPECTION METHOD AND COMPONENT MOUNTING METHOD
Next Patent: COMPONENT RECOGNITION METHOD, COMPONENT INSPECTION METHOD AND COMPONENT MOUNTING METHOD