Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CARRIER-PROVIDED COPPER FOIL, METHOD OF PRODUCING CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE AND METHOD OF PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2014172179
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide carrier-provided copper foil which has high adhesion between a carrier and ultrathin copper foil before a step of laminating on an insulated substrate, does not cause extreme increase or decrease of the adhesion between the carrier and the ultrathin copper foil in the step of laminating on the insulated substrate, allows easy peeling in the carrier/ultrathin copper foil boundary surface and has good etching properties of the ultrathin copper foil.SOLUTION: In carrier-provided copper foil, an intermediate layer contains Ni. When an insulated substrate is adhered to an ultrathin copper layer by thermal compression in the atmosphere in conditions of a pressure of 20 kgf/cmand a duration of 220°C×2 h; the carrier is peeled by the method of JIS C 6471; and the surface of the ultrathin copper layer on the intermediate layer side is removed to a depth of 0.1 μm by etching, the adhesion amount of Ni remaining in the ultrathin copper layer is 200 μg/dmor smaller.

Inventors:
HONDA MISATO
KOHIKI MICHIYA
NAGAURA YUTA
Application Number:
JP2013043570A
Publication Date:
September 22, 2014
Filing Date:
March 05, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
B32B15/08; C25D1/04; C25D7/06; C25D11/38; H05K1/09
Domestic Patent References:
JP2010222657A2010-10-07
JP2001089892A2001-04-03
JP2013001993A2013-01-07
JP2014173094A2014-09-22
JP2007314855A2007-12-06
JP2007186797A2007-07-26
JP2006022406A2006-01-26
JP2005076091A2005-03-24
JP2005502496A2005-01-27
JP2002292788A2002-10-09
JP2001301087A2001-10-30
JP2004103681A2004-04-02
Foreign References:
WO2002024444A12002-03-28
Attorney, Agent or Firm:
Axis international patent business corporation