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Title:
CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, LAMINATE, LAMINATE SHEET, ELECTRONIC EQUIPMENT AND METHOD OF PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015199355
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide carrier-provided copper foil having good etching properties.SOLUTION: Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order. When the carrier-provided copper foil is heated to 500°C at a rate of 30°C/min, the moisture content is 160 ppm/g or lower.

Inventors:
MIYAMOTO NOBUAKI
HONDA MISATO
ISHII MASASHI
Application Number:
JP2015074348A
Publication Date:
November 12, 2015
Filing Date:
March 31, 2015
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
B32B15/04; H05K1/09; H05K3/38
Domestic Patent References:
JP2007186782A2007-07-26
JP2012099857A2012-05-24
JP2001127429A2001-05-11
JP2013001993A2013-01-07
JPH08181412A1996-07-12
JP2015047795A2015-03-16
Foreign References:
WO2014042201A12014-03-20
WO2012133638A12012-10-04
US20120196144A12012-08-02
Attorney, Agent or Firm:
Axis International Patent Business Corporation



 
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