Title:
CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, LAMINATE, LAMINATE SHEET, ELECTRONIC EQUIPMENT AND METHOD OF PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015200026
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide carrier-provided copper foil having good circuit formability.SOLUTION: Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order, and the intermediate layer contains Ni. When the carrier is peeled from the carrier-provided copper foil, the average value of the atomic concentration ratio Cu/Ni is 5-40%, determined by conducting depth direction analysis of the carrier by XPS from the surface of the carrier on the side of the intermediate layer and determining the ratio at the depth of 3 nm from the surface of the carrier on the side of the intermediate layer.
Inventors:
HONDA MISATO
MIYAMOTO NOBUAKI
ISHII MASASHI
MIYAMOTO NOBUAKI
ISHII MASASHI
Application Number:
JP2015074547A
Publication Date:
November 12, 2015
Filing Date:
March 31, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/22; B32B15/04; C25D1/04; H01B5/02; H01B5/14; H01B13/00; H05K1/03; H05K3/46
Attorney, Agent or Firm:
Axis International Patent Business Corporation