Title:
CARRIER FOR SEMICONDUCTOR SUBSTRATE LAPPING
Document Type and Number:
Japanese Patent JP2640422
Kind Code:
B2
Abstract:
PURPOSE: To reduce the deformation and wear of part alone of the end surface of a circular substrate at the time of semiconductor substrate lapping.
CONSTITUTION: The shape of each carrier hole 11 of a lapping carrier 10 is hexagonal, ad when a circular semiconductor substrate 3 having an OF portion is furnishes into it, each semiconductor substrate 3 is pressed in a fixed direction due to the movement directions of the carrier 10, an upper surface table and a lower surface table, and as the shape of each carrier hole 11 is hexagonal, each semiconductor substrate 3 is supported at two points by means of each carrier hole 11 and rotates due to the change of the support direction of the carrier 10 following its revolution and the direction against which it is pressed. As a result, each semiconductor substrate 3 is made to rotate forcedly regardless of the uneven thickness of each semiconductor substrate 3, the precision or the like of the upper and lower surface tables 4, 5, and all the parts of the end surface of each semiconductor 3 come into contact with each carrier hole 11, and the deformation and wear of only a part of the end surface are prevented.
Inventors:
OOKUBO KIMYA
Application Number:
JP5518794A
Publication Date:
August 13, 1997
Filing Date:
February 28, 1994
Export Citation:
Assignee:
SUMITOMO SHICHITSUKUSU KK
International Classes:
B24B37/27; B24B37/28; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
| JP52125188U |
Attorney, Agent or Firm:
Yoshihisa Oshida