Title:
化学機械研磨用の小さいパッドのためのキャリア
Document Type and Number:
Japanese Patent JP6918809
Kind Code:
B2
Abstract:
A chemical mechanical polishing system includes a substrate support configured to hold a substrate during a polishing operation, a polishing pad assembly include a membrane and a polishing pad portion, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad carrier includes a casing having a cavity and an aperture connecting the cavity to an exterior of the casing. The polishing pad assembly is positioned in the casing such that the membrane divides the cavity into a first chamber and a second chamber and the aperture extends from the second chamber. The polishing pad carrier and polishing pad assembly are positioned and configured such that at least during application of a sufficient pressure to the first chamber the polishing pad portion projects through the aperture.
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Inventors:
Chen, Hui
Zuniga, Stephen M.
Chen, Han Qi
Lau, Eric
Shin, Garrett Hoi
Chang, Shaw-Sun
Zuniga, Stephen M.
Chen, Han Qi
Lau, Eric
Shin, Garrett Hoi
Chang, Shaw-Sun
Application Number:
JP2018537463A
Publication Date:
August 11, 2021
Filing Date:
December 02, 2016
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/304; B24B37/10
Domestic Patent References:
| JP2001237206A | ||||
| JP2004356563A |
Foreign References:
| WO2016003545A1 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation