Title:
CARRIER TAPE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3463634
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To manufacture a carrier tape in COF(chip on film) so that it can be transported by pin rollers smoothly and its sprockets may not be deformed, through the base film is comparatively thine.
SOLUTION: Specified Cu wirings 112 are formed on wiring forming regions at width center of the surface of a long base film 101, and first reinforcing band-like Cu layers 113 are formed on the both side regions in the width direction of the surface of the base film 101. As the result, if the film 101 is comparatively thine, the substantial strength of the portions of sprockets 107 can be ensured as expected, and the first reinforcing layer 113 has slightly larger openings 114 than the sprockets 107 to avoid contact with the pins of the conveying pin rollers.
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| JPH0540177 | [Name of device] Electronic component carrier |
Inventors:
Koichi Saito
Application Number:
JP34752499A
Publication Date:
November 05, 2003
Filing Date:
December 07, 1999
Export Citation:
Assignee:
CASIO COMPUTER CO.,LTD.
International Classes:
B65D73/02; H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP6236905A | ||||
| JP54121251U |
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