Title:
CARRIER TAPE AND MOLDING METHOD OF CARRIER TAPE
Document Type and Number:
Japanese Patent JP2023175257
Kind Code:
A
Abstract:
To provide a molding method of carrier tape in which burr generation in a bottom hole is suppressed, and to provide a carrier tape.SOLUTION: A molding method of a carrier tape which has a storage recessed part capable of storing components includes: a bottom hole punching step S1 of punching a bottom hole at a position scheduled for bottom surface molding of a storage recessed part in a resin sheet, before molding the storage recessed part in the resin sheet; and a storage recessed part molding step S3 of press-molding the storage recessed part in the resin sheet. Also, a carrier tape which has the storage recessed part capable of storing components includes the bottom hole on the bottom surface of the storage recessed part, and the bottom hole is punched before the press-molding of the storage recessed part.SELECTED DRAWING: Figure 2B
Inventors:
ARAI YUKI
Application Number:
JP2022087611A
Publication Date:
December 12, 2023
Filing Date:
May 30, 2022
Export Citation:
Assignee:
SHIN ETSU POLYMER CO LTD
International Classes:
B65B47/04; B65B47/02
Attorney, Agent or Firm:
Patent Attorney Corporation Sakamoto International Patent and Trademark Office