To provide a carrier tape mount for conveying electronic components which is used for a carrier tape for conveying chip-shaped electronic components such as a capacitor and a resistor.

In the carrier tape mount for conveying the chip-shaped electronic components, the carrier tape mount is electrically conductive, and a coating mixture including an electrically conductive zinc antimonate and a water-soluble resin binder. The water-soluble resin binder includes one or more kinds selected from polyvinyl alcohol, polyacrylamide, starch and its modified, and carboxyl methyl cellulose. The electrically conductive zinc antimonate is preferably sol.