Title:
キャリヤ、キャリヤを製造する方法および電子機器
Document Type and Number:
Japanese Patent JP4526823
Kind Code:
B2
Abstract:
The carrier ( 30 ) comprises a first etch mask ( 14 ), a first metal layer ( 11 ), an intermediate layer ( 12 ), a second metal layer ( 13 ) and a second etch mask ( 17 ). Both the first and the second etch mask ( 14, 17 ) can be provided in one step by means of electrochemical plating. After the first metal layer ( 11 ) and the intermediate layer ( 12 ) have been patterned through the first etch mask ( 14 ), an electric element ( 20 ) can be suitably attached to the carrier ( 30 ) using conductive means. In this patterning operation, the intermediate layer ( 12 ) is etched further so as to create underetching below the first metal layer ( 11 ). After the provision of an encapsulation ( 40 ), the second metal layer ( 13 ) is patterned through the second etch mask ( 17 ). In this manner, a solderable device ( 10 ) is obtained without a photolithographic step during the assembly process.
Inventors:
Rolf, A. Y. Fluenhuth
Paul, Dijkstra
Cornelis, H. Shriks
Peter, Way M. Van, De, Water
Paul, Dijkstra
Cornelis, H. Shriks
Peter, Way M. Van, De, Water
Application Number:
JP2003582812A
Publication Date:
August 18, 2010
Filing Date:
April 10, 2003
Export Citation:
Assignee:
NXP B.V.
International Classes:
H01L23/12; A23G3/00; A23G3/36; A23G4/00; A23G4/12; A23L1/28; A23L1/30; A61K35/74; A61K35/747; A61P1/02; C12N1/14; H01L21/48; H01L23/31; H05K3/06; C12R1/225; H05K1/18
Domestic Patent References:
| JP2001110945A | ||||
| JP4328853A | ||||
| JP2001024135A | ||||
| JP2002076182A | ||||
| JP11251505A | ||||
| JP8037272A | ||||
| JP5160319A |
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Takeshi Sekine
Takahashi
Hidetoshi Tachibana
Takeshi Sekine
Takahashi