To provide a carrying-in device capable of carrying workpieces such as semiconductor wafers to holding means by using a simpler and lower-cost structure compared to the conventional structure.

A work unit supporting member 110 for annularly arranging and holding a plurality of work units 7 is attachably/detachably supported by a supporting part 124 of a rotating support means 122 provided on a supporting base 120. The work unit supporting member 110 is rotated by a rotating part 123 so that the work units 7 are sequentially positioned at a carry-in position immediately above holding means 32 of a cutting device 10. An annular frame 5 of the work unit 7 positioned at the carry-in position is held by an insertion finger part 135 of carrying means 130 which has been lowered, while at the same time being separated from a holding part 116 of the work unit supporting member 110. In this way, the annular frame 5 is placed on and supported by the holding means 32.