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Title:
WIRING CONNECTION METHOD USING ANISOTROPIC CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP3282795
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a wiring connection method which is capable of exhibiting superior connection of high strength.
SOLUTION: A connected member 1 is mounted on a connection member 3 by the use of an anisotropic conductive film 2, the board lands 4 of the connected member 1 are connected to the bump 5 of the connection member 3 with the anisotropic conductive film 2. For film, recesses 20 have been provided previously to the anisotropic conductive film 2 at bump joint positions. Thus, superior connection of high reliability can be realized.


Inventors:
Yasuaki Matsunaga
Kenji Kondo
Masayuki Aoyama
Koji Kondo
Application Number:
JP8392598A
Publication Date:
May 20, 2002
Filing Date:
March 30, 1998
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
H01L21/60; H01L21/603; (IPC1-7): H01L21/60
Domestic Patent References:
JP9283566A
Attorney, Agent or Firm:
Hiroshi Ohkawa