Title:
CASE MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JP3046568
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To restrain any trouble from arising even if a metal base circuit board with burrs is used as it is by a method wherein the edge of the-opening of a case is brought into contact with the side and plane of a metal base circuit board, and a groove which houses the burrs is provided in the face of the edge of the case opening which confronts the peripheral edge of the metal base board.
SOLUTION: A groove 9 is provided in the face of the opening edge of a case 5 which confronts the peripheral edge of a metal base circuit board 1 so as to house the burrs 4 of the circuit board 1. Therefore, a burr removing operation which is usually required for mounting the metal base circuit board 1 in a case 5 can be dispensed with. When the metal base circuit board 1 is bonded to the case 5 and furthermore liquid sealing material is injected to the surface of a circuit, the groove 9 functions as a liquid well to restrain the liquid sealing material from leaking out. When the groove 9 is formed like an arc in cross section, stress imposed on a case mounting structure when it is mounted or it is put in actual use can be relaxed by the groove 9, so that the case is less chipped or cracked.
Inventors:
Makoto Fukuda
Application Number:
JP24649697A
Publication Date:
May 29, 2000
Filing Date:
September 11, 1997
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
H05K5/06; H01L23/02; H01L23/04; (IPC1-7): H01L23/02; H05K5/06
Domestic Patent References:
| JP470752U |