Title:
CASTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS58157804
Kind Code:
A
Abstract:
PURPOSE: To prepare the titled composition having excellent impregnation property into coil, etc., and high filler content, and giving a cured product having high strength, by compounding a casting resin with a large amount of spherical inorganic filler powder.
CONSTITUTION: A casting resin (e.g. bisphenol-type liquid epoxy resin) is compounded with spherical inorganic filler powder (e.g. glass beads). The amount of the inorganic filler is ≥50vol% of the whole fillers.
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| JP2002212269 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
Inventors:
KAWAMURA NORIYUKI
YAMAGIWA YOSHINOBU
YAMAGIWA YOSHINOBU
Application Number:
JP4132082A
Publication Date:
September 20, 1983
Filing Date:
March 16, 1982
Export Citation:
Assignee:
TOSHIBA CHEM PROD
International Classes:
C08K3/00; C08F2/44; C08G59/00; C08G85/00; C08L63/00; C08L67/00; C08L67/06; (IPC1-7): C08F2/44; C08G85/00; C08K3/00
Domestic Patent References:
| JPS49110734A | 1974-10-22 | |||
| JPS56129253A | 1981-10-09 | |||
| JPS56136838A | 1981-10-26 |
Attorney, Agent or Firm:
Suyama Saichi