CATHODE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

Title:

CATHODE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

Document Type and Number:

Japanese Patent JP2005251430

Kind Code:

A

Abstract:

To provide a cathode substrate having good electric charge injection efficiency by preventing diffusion of electron emitted from an emitter, of which, the electron injection efficiency is hardly scattered between respective cathode substrates, and to provide a manufacturing method of the same.

A cathode electrode layer 12, an insulation layer 14, and a gate electrode layer 15 are formed on a processing substrate 11 successively, and an emitter E is arranged on a bottom part of holes 14a formed on the insulation layer. In this case, a gate opening part is constructed by a plurality of openings 16 of which, opening area is smaller than that of the hole of the insulation layer, and respective openings are made to congregate just on the hole of the insulation layer so as to face the emitter.

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Inventors:

NAKANO MINAO
HIRAKAWA MASAAKI
MIURA OSAMU
MURAKAMI HIROHIKO
OKASAKA KENSUKE
KOJIMA TOMOAKI

Application Number:

JP2004056624A

Publication Date:

September 15, 2005

Filing Date:

March 01, 2004

Export Citation:

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Assignee:

ULVAC CORP
ULVAC SEIMAKU KK

International Classes:

H01J9/02; H01J1/304; H01J3/02; H01J29/48; H01J31/12; H01L29/76; (IPC1-7): H01J1/304; H01J9/02

Attorney, Agent or Firm:

Kiyoshi Higashida
Masaaki Yamashita

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